Die Bonding

CoolLED can provide both conductive and non-conductive diebonding using epoxies and eutectic solders.  There are two fully automatic die bonders and one manual die bonder capable of high throughput under tight tolerance die placement.  The die bonders are used for a variety of semiconductor die types including LEDs, ASICs, MEMs and Sensors.

Manufacturing can diebond to a variety of substrate materials including FR4, Alumina, Metalised Ceramic, Carbon Fibre and Chip on Flex as single die or multiple die arrays for Chip scale packaging / CSPs. We have extensive expertise in the bonding of Opto-electronic die creating LED arrays for a variety of applications.  In addition to Optoelectronic die placement there is extensive thermal design / management expertise.